Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating

Hai, N.T.M.; Krämer, K.W.; Fluegel, A.; Arnold, M.; Mayer, D; Broekmann, P. (2012). Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating. Electrochimica acta, 83, pp. 367-375. Kidlington, UK: Elsevier Science 10.1016/j.electacta.2012.07.036

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Item Type:	Journal Article (Original Article)
Division/Institute:	08 Faculty of Science > Department of Chemistry, Biochemistry and Pharmaceutical Sciences (DCBP)
UniBE Contributor:	Krämer, Karl, Broekmann, Peter
ISSN:	0013-4686
Publisher:	Elsevier Science
Language:	English
Submitter:	Factscience Import
Date Deposited:	04 Oct 2013 14:37
Last Modified:	05 Dec 2022 14:11
Publisher DOI:	10.1016/j.electacta.2012.07.036
Web of Science ID:	000311327100050
URI:	https://boris.unibe.ch/id/eprint/14775 (FactScience: 221898)