Cedeño López, A.; Grimaudo, V.; Riedo, A.; Tulej, M.; Wiesendanger, R.; Lukmanov, R.; Moreno-García, P.; Lörtscher, E.; Wurz, P.; Broekmann, P. (2020). Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry. Analytical chemistry, 92(1), pp. 1355-1362. American Chemical Society 10.1021/acs.analchem.9b04530
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The application of a novel UV fs Laser Ablation Ionization Mass Spectrometry approach for chemical depth profiling of low-melting point, high surface roughness SnAg solder bump features is presented. The obtained submicrometer resolved three-dimensional compositional data reveal unprecedented information on the distribution of individual elements inside the solder bump matrix. Moreover, the determination of matrix-matched relative sensitivity coefficients allows the first report on quantitative assessment of the SnAg alloy composition. These results significantly contribute to an in-depth understanding of the SnAg plating process. This experimental procedure may find application in future additive performance screening.
Item Type: |
Journal Article (Original Article) |
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Division/Institute: |
08 Faculty of Science > Department of Chemistry, Biochemistry and Pharmaceutical Sciences (DCBP) 08 Faculty of Science > Physics Institute > Space Research and Planetary Sciences 08 Faculty of Science > Physics Institute |
UniBE Contributor: |
Cedeño López, Alena, Riedo, Valentine, Tulej, Marek, Wiesendanger, Reto, Lukmanov, Rustam, Moreno, Pavel, Wurz, Peter, Broekmann, Peter |
Subjects: |
500 Science > 570 Life sciences; biology 500 Science > 540 Chemistry 500 Science > 520 Astronomy 500 Science > 530 Physics 600 Technology > 620 Engineering |
ISSN: |
0003-2700 |
Publisher: |
American Chemical Society |
Language: |
English |
Submitter: |
Dora Ursula Zimmerer |
Date Deposited: |
18 Feb 2020 11:47 |
Last Modified: |
05 Dec 2022 15:36 |
Publisher DOI: |
10.1021/acs.analchem.9b04530 |
BORIS DOI: |
10.7892/boris.140098 |
URI: |
https://boris.unibe.ch/id/eprint/140098 |