Hai, N.T.M.; Krämer, K.W.; Fluegel, A.; Arnold, M.; Mayer, D; Broekmann, P.
(2012).
Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating.
Electrochimica acta, 83, pp. 367-375.
Kidlington, UK: Elsevier Science
10.1016/j.electacta.2012.07.036
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Item Type: |
Journal Article
(Original Article)
|
Division/Institute: |
08 Faculty of Science > Department of Chemistry, Biochemistry and Pharmaceutical Sciences (DCBP) |
UniBE Contributor: |
Krämer, Karl, Broekmann, Peter |
ISSN: |
0013-4686 |
Publisher: |
Elsevier Science |
Language: |
English |
Submitter: |
Factscience Import
|
Date Deposited: |
04 Oct 2013 14:37 |
Last Modified: |
05 Dec 2022 14:11 |
Publisher DOI: |
10.1016/j.electacta.2012.07.036 |
Web of Science ID: |
000311327100050 |
URI: |
https://boris.unibe.ch/id/eprint/14775 (FactScience: 221898) |
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