Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating

Hai, N.T.M.; Krämer, K.W.; Fluegel, A.; Arnold, M.; Mayer, D; Broekmann, P. (2012). Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating. Electrochimica acta, 83, pp. 367-375. Kidlington, UK: Elsevier Science 10.1016/j.electacta.2012.07.036

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Item Type:

Journal Article (Original Article)

Division/Institute:

08 Faculty of Science > Departement of Chemistry and Biochemistry

UniBE Contributor:

Krämer, Karl and Broekmann, Peter

ISSN:

0013-4686

Publisher:

Elsevier Science

Language:

English

Submitter:

Factscience Import

Date Deposited:

04 Oct 2013 14:37

Last Modified:

04 Jul 2014 12:21

Publisher DOI:

10.1016/j.electacta.2012.07.036

Web of Science ID:

000311327100050

URI:

https://boris.unibe.ch/id/eprint/14775 (FactScience: 221898)

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