Suppressor Effects during Copper Superfilling of Sub-100 nm Lines

Huang, Qiang; Baker-O`Neal, Brett; Kelly, James; Broekmann, Peter; Wirth, Alexandra; Martin, Marc; Hahn, Markus; Wagner, Anja; Mayer, Dieter (2009). Suppressor Effects during Copper Superfilling of Sub-100 nm Lines. Electrochemical and solid-state letters, 12(4), D27-D31. Pennington, NJ: Electrochemical Society 10.1149/1.3078074

Full text not available from this repository. (Request a copy)

Item Type:

Journal Article (Original Article)

Division/Institute:

08 Faculty of Science > Departement of Chemistry and Biochemistry

UniBE Contributor:

Broekmann, Peter

ISSN:

1099-0062

Publisher:

Electrochemical Society

Language:

English

Submitter:

Factscience Import

Date Deposited:

04 Oct 2013 15:20

Last Modified:

17 Mar 2015 22:44

Publisher DOI:

10.1149/1.3078074

Web of Science ID:

000263518300014

URI:

https://boris.unibe.ch/id/eprint/36058 (FactScience: 203180)

Actions (login required)

Edit item Edit item
Provide Feedback