Tailored Design of Suppressor Additives for Copper Plating by Combining Functionalities

Nguyen, Thi; Janser, Ariane Félice; Lüdi, Nicola; Broekmann, Peter (2013). Tailored Design of Suppressor Additives for Copper Plating by Combining Functionalities. ECS electrochemistry letters, 2(11), D52-D54. Electrochemical Society (ECS) 10.1149/2.005311eel

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Item Type:

Journal Article (Original Article)

Division/Institute:

08 Faculty of Science > Departement of Chemistry and Biochemistry

UniBE Contributor:

Nguyen, Thi; Janser, Ariane Félice; Lüdi, Nicola and Broekmann, Peter

Subjects:

500 Science > 570 Life sciences; biology
500 Science > 540 Chemistry
500 Science

ISSN:

2162-8726

Publisher:

Electrochemical Society (ECS)

Language:

English

Submitter:

Beatrice Niederhauser

Date Deposited:

29 Jul 2014 09:06

Last Modified:

29 Jul 2014 09:06

Publisher DOI:

10.1149/2.005311eel

URI:

https://boris.unibe.ch/id/eprint/48974

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