Electrochemical oscillation in the additives-assisted copper electroplating: a mechanistic study on the role of intermediate species at the copper/electrolyte interface

Nguyen, H.; Odermatt, Jan; Grimaudo, Valentine; Krämer, Karl; Broekmann, Peter (2012). Electrochemical oscillation in the additives-assisted copper electroplating: a mechanistic study on the role of intermediate species at the copper/electrolyte interface. Book of Abstracts(P2.070), p. 469.

Item Type:

Conference or Workshop Item (Poster)

Division/Institute:

08 Faculty of Science > Department of Chemistry, Biochemistry and Pharmaceutical Sciences (DCBP)

UniBE Contributor:

Odermatt, Jan, Riedo, Valentine, Krämer, Karl, Broekmann, Peter

Subjects:

500 Science > 570 Life sciences; biology
500 Science > 540 Chemistry

Language:

English

Submitter:

Tamara Leuenberger

Date Deposited:

07 Jul 2014 15:17

Last Modified:

05 Dec 2022 14:35

URI:

https://boris.unibe.ch/id/eprint/54412 (FactScience: 226091)

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