Riedo, Andreas; Grimaudo, V.; Moreno-García, P.; Neuland, Maike Brigitte; Tulej, Marek; Wurz, Peter; Broekmann, Peter (2015). High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures. Journal of analytical atomic spectrometry, 30(12), pp. 2371-2374. Royal Society of Chemistry 10.1039/C5JA00295H
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Laser ablation/ionisation mass spectrometry with a vertical resolution at a nanometre scale was applied for the quantitative characterisation of the chemical composition of additive-assisted Cu electroplated deposits used in the microchip industry. The detailed chemical analysis complements information gathered by optical techniques and allows new insights into the metal deposition process.
Item Type: |
Journal Article (Original Article) |
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Division/Institute: |
08 Faculty of Science > Department of Chemistry, Biochemistry and Pharmaceutical Sciences (DCBP) 08 Faculty of Science > Physics Institute > Space Research and Planetary Sciences 08 Faculty of Science > Physics Institute |
UniBE Contributor: |
Riedo, Andreas, Riedo, Valentine, Neuland, Maike Brigitte, Tulej, Marek, Wurz, Peter, Broekmann, Peter |
Subjects: |
500 Science > 570 Life sciences; biology 500 Science > 540 Chemistry 500 Science > 520 Astronomy 600 Technology > 620 Engineering 500 Science > 530 Physics |
ISSN: |
0267-9477 |
Publisher: |
Royal Society of Chemistry |
Language: |
English |
Submitter: |
Andreas Riedo |
Date Deposited: |
22 Dec 2015 10:32 |
Last Modified: |
05 Dec 2022 14:50 |
Publisher DOI: |
10.1039/C5JA00295H |
BORIS DOI: |
10.7892/boris.74443 |
URI: |
https://boris.unibe.ch/id/eprint/74443 |
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