High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures

Riedo, Andreas; Grimaudo, V.; Moreno-García, P.; Neuland, Maike Brigitte; Tulej, Marek; Wurz, Peter; Broekmann, Peter (2015). High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures. Journal of analytical atomic spectrometry, 30(12), pp. 2371-2374. Royal Society of Chemistry 10.1039/C5JA00295H

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Laser ablation/ionisation mass spectrometry with a vertical resolution at a nanometre scale was applied for the quantitative characterisation of the chemical composition of additive-assisted Cu electroplated deposits used in the microchip industry. The detailed chemical analysis complements information gathered by optical techniques and allows new insights into the metal deposition process.

Item Type:

Journal Article (Original Article)

Division/Institute:

08 Faculty of Science > Departement of Chemistry and Biochemistry
08 Faculty of Science > Physics Institute > Space Research and Planetary Sciences
08 Faculty of Science > Physics Institute

UniBE Contributor:

Riedo, Andreas; Riedo, Valentine; Neuland, Maike Brigitte; Tulej, Marek; Wurz, Peter and Broekmann, Peter

Subjects:

500 Science > 570 Life sciences; biology
500 Science > 540 Chemistry
500 Science > 520 Astronomy
600 Technology > 620 Engineering
500 Science > 530 Physics

ISSN:

0267-9477

Publisher:

Royal Society of Chemistry

Language:

English

Submitter:

Andreas Riedo

Date Deposited:

22 Dec 2015 10:32

Last Modified:

28 Nov 2018 11:06

Publisher DOI:

10.1039/C5JA00295H

BORIS DOI:

10.7892/boris.74443

URI:

https://boris.unibe.ch/id/eprint/74443

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