Nguyen, Thi Minh Hai; Broekmann, Peter (2015). Smart Hybrid Polymers for Advanced Damascene Electroplating: Combination of Superfill and Leveling Properties. ChemElectroChem, 2(8), pp. 1096-1099. Wiley 10.1002/celc.201500104
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A successful bottom-up fill of single Damascene test features is achieved by using a two-component additive package consisting of bis-(sodium-sulfopropyl)-disulfide (SPS) and Imep polymers (polymerizates of imidazole and epichlorohydrin). In addition, a remarkable leveling effect is observed. Clearly, the Imep additive combines bottom-up fill capabilities with leveling characteristics in one single polymer component. These unique hybrid properties of the Imep are rationalized on the basis of an extended N-NDR (N-shaped negative differential resistance) being present in the linear-sweep voltammogram of the SPS/Imep additive system during Cu electrodeposition.
Item Type: |
Journal Article (Original Article) |
|---|---|
Division/Institute: |
08 Faculty of Science > Department of Chemistry, Biochemistry and Pharmaceutical Sciences (DCBP) 08 Faculty of Science > Other Institutions > Teaching Staff, Faculty of Science |
UniBE Contributor: |
Nguyen, Thi Minh Hai, Broekmann, Peter |
Subjects: |
500 Science > 570 Life sciences; biology 500 Science > 540 Chemistry 500 Science |
ISSN: |
2196-0216 |
Publisher: |
Wiley |
Language: |
English |
Submitter: |
Beatrice Niederhauser |
Date Deposited: |
02 Feb 2016 15:43 |
Last Modified: |
05 Dec 2022 14:51 |
Publisher DOI: |
10.1002/celc.201500104 |
BORIS DOI: |
10.7892/boris.75073 |
URI: |
https://boris.unibe.ch/id/eprint/75073 |
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