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Nguyen, Thi Minh Hai; Broekmann, Peter (2015). Smart Hybrid Polymers for Advanced Damascene Electroplating: Combination of Superfill and Leveling Properties. ChemElectroChem, 2(8), pp. 1096-1099. Wiley 10.1002/celc.201500104
Nguyen, Thi Minh Hai; Lechner, David; Stricker, Florian Ulrich; Furrer, Julien; Broekmann, Peter (2015). Combined Secondary Ion Mass Spectrometry Depth Profiling and Focused Ion Beam Analysis of Cu Films Electrodeposited under Oscillatory Conditions. ChemElectroChem, 2(5), pp. 664-671. Wiley 10.1002/celc.201402427
Huynh, Thi; Weiss, Florian; Nguyen, Thi; Reckien, Werner; Bredow, Thomas; Fluegel, Alexander; Arnold, Marco; Mayer, Dieter; Keller, Hubert; Broekmann, Peter (2013). On the role of halides and thiols in additive-assisted copper electroplating. Electrochimica acta, 89, pp. 537-548. Elsevier Science 10.1016/j.electacta.2012.10.152
Huynh, Thi; Nguyen, Thi; Broekmann, Peter (2013). Quasi-Reversible Interaction of MPS and Chloride on Cu(100) Studied by In Situ STM. Journal of the electrochemical society, 160(12), D3063-D3069. Electrochemical Society (ECS) 10.1149/2.012312jes
Nguyen, Thi; Janser, Ariane Félice; Lüdi, Nicola; Broekmann, Peter (2013). Tailored Design of Suppressor Additives for Copper Plating by Combining Functionalities. ECS electrochemistry letters, 2(11), D52-D54. Electrochemical Society (ECS) 10.1149/2.005311eel
