Smart Hybrid Polymers for Advanced Damascene Electroplating: Combination of Superfill and Leveling Properties

Nguyen, Thi Minh Hai; Broekmann, Peter (2015). Smart Hybrid Polymers for Advanced Damascene Electroplating: Combination of Superfill and Leveling Properties. ChemElectroChem, 2(8), pp. 1096-1099. Wiley 10.1002/celc.201500104

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A successful bottom-up fill of single Damascene test features is achieved by using a two-component additive package consisting of bis-(sodium-sulfopropyl)-disulfide (SPS) and Imep polymers (polymerizates of imidazole and epichlorohydrin). In addition, a remarkable leveling effect is observed. Clearly, the Imep additive combines bottom-up fill capabilities with leveling characteristics in one single polymer component. These unique hybrid properties of the Imep are rationalized on the basis of an extended N-NDR (N-shaped negative differential resistance) being present in the linear-sweep voltammogram of the SPS/Imep additive system during Cu electrodeposition.

Item Type:

Journal Article (Original Article)

Division/Institute:

08 Faculty of Science > Departement of Chemistry and Biochemistry
08 Faculty of Science > Other Institutions > Teaching Staff, Faculty of Science

UniBE Contributor:

Nguyen, Thi Minh Hai and Broekmann, Peter

Subjects:

500 Science > 570 Life sciences; biology
500 Science > 540 Chemistry
500 Science

ISSN:

2196-0216

Publisher:

Wiley

Language:

English

Submitter:

Beatrice Niederhauser

Date Deposited:

02 Feb 2016 15:43

Last Modified:

04 Feb 2016 01:22

Publisher DOI:

10.1002/celc.201500104

BORIS DOI:

10.7892/boris.75073

URI:

https://boris.unibe.ch/id/eprint/75073

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