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Huynh, Thi; Weiss, Florian; Nguyen, Thi; Reckien, Werner; Bredow, Thomas; Fluegel, Alexander; Arnold, Marco; Mayer, Dieter; Keller, Hubert; Broekmann, Peter (2013). On the role of halides and thiols in additive-assisted copper electroplating. Electrochimica acta, 89, pp. 537-548. Elsevier Science 10.1016/j.electacta.2012.10.152
