On the role of halides and thiols in additive-assisted copper electroplating

Huynh, Thi; Weiss, Florian; Nguyen, Thi; Reckien, Werner; Bredow, Thomas; Fluegel, Alexander; Arnold, Marco; Mayer, Dieter; Keller, Hubert; Broekmann, Peter (2013). On the role of halides and thiols in additive-assisted copper electroplating. Electrochimica acta, 89, pp. 537-548. Elsevier Science 10.1016/j.electacta.2012.10.152

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Item Type:

Journal Article (Original Article)

Division/Institute:

08 Faculty of Science > Departement of Chemistry and Biochemistry

UniBE Contributor:

Huynh, Thi; Weiss, Florian; Nguyen, Thi and Broekmann, Peter

Subjects:

500 Science > 570 Life sciences; biology
500 Science > 540 Chemistry
500 Science

ISSN:

0013-4686

Publisher:

Elsevier Science

Language:

English

Submitter:

Beatrice Niederhauser

Date Deposited:

25 Jul 2014 16:20

Last Modified:

25 Jul 2014 16:20

Publisher DOI:

10.1016/j.electacta.2012.10.152

URI:

https://boris.unibe.ch/id/eprint/48929

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