Huynh, T.T.M.

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Journal Article

Hai, N.T.M.; Huynh, T.T.M.; Fluegel, A.; Arnold, M.; Mayer, D.; Reckien, W.; Bredow, T.; Broekmann, P. (2012). Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating. Electrochimica acta, 70, pp. 286-295. Kidlington, UK: Elsevier Science 10.1016/j.electacta.2012.03.054

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