 | Up a level |
Huynh, Thi; Weiss, Florian; Nguyen, Thi; Reckien, Werner; Bredow, Thomas; Fluegel, Alexander; Arnold, Marco; Mayer, Dieter; Keller, Hubert; Broekmann, Peter (2013). On the role of halides and thiols in additive-assisted copper electroplating. Electrochimica acta, 89, pp. 537-548. Elsevier Science 10.1016/j.electacta.2012.10.152
Huynh, Thi; Nguyen, Thi; Broekmann, Peter (2013). Quasi-Reversible Interaction of MPS and Chloride on Cu(100) Studied by In Situ STM. Journal of the electrochemical society, 160(12), D3063-D3069. Electrochemical Society (ECS) 10.1149/2.012312jes
