Nguyen, H.

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Nguyen, H.; Broekmann, Peter; Flügel, A.; Mayer, D.; Simona, Fabio; Cascella, Michele (2012). From Structure to function: Towards an atomistic understanding of the action of additives relevant for the Damascene and TSV copper plating. Book of Abstracts, p. 309.

Nguyen, H.; Broekmann, Peter (2012). From fundamentals to applications of plating additives for Damascene process and 3D-TVS technology. In: Metrohm Autolab User Meeting 2012. Zofingen, Switzerland. 04.09.2012.

Nguyen, H.; Odermatt, Jan; Grimaudo, Valentine; Krämer, Karl; Broekmann, Peter (2012). Electrochemical oscillation in the additives-assisted copper electroplating: a mechanistic study on the role of intermediate species at the copper/electrolyte interface. Book of Abstracts(P2.070), p. 469.

Nguyen, H.; Broekmann, Peter (2012). Redox-active Safranine/Janus Green B leveler additives at Cu(100)/electrolyte interface. In: CMD-24 / 24 24th General Conference of the Condensed Matter Division of the European Physical Society. Edinburgh, Scotland, UK. 03.-05.09.2012.

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