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Huynh, Thi; Weiss, Florian; Nguyen, Thi; Reckien, Werner; Bredow, Thomas; Fluegel, Alexander; Arnold, Marco; Mayer, Dieter; Keller, Hubert; Broekmann, Peter (2013). On the role of halides and thiols in additive-assisted copper electroplating. Electrochimica acta, 89, pp. 537-548. Elsevier Science 10.1016/j.electacta.2012.10.152
Huang, Qiang; Baker-O`Neal, Brett; Kelly, James; Broekmann, Peter; Wirth, Alexandra; Martin, Marc; Hahn, Markus; Wagner, Anja; Mayer, Dieter (2009). Suppressor Effects during Copper Superfilling of Sub-100 nm Lines. Electrochemical and solid-state letters, 12(4), D27-D31. Pennington, NJ: Electrochemical Society 10.1149/1.3078074
