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Cedeño López, A.; Grimaudo, V.; Riedo, A.; Tulej, M.; Wiesendanger, R.; Lukmanov, R.; Moreno-García, P.; Lörtscher, E.; Wurz, P.; Broekmann, P. (2021). Characterization of femtosecond laser ablation processes on as-deposited SnAg solder alloy using laser ablation ionization mass spectrometry. Spectrochimica acta. Part B - atomic spectroscopy, 180, p. 106145. Elsevier 10.1016/j.sab.2021.106145
Cedeño López, A.; Grimaudo, V.; Riedo, A.; Tulej, M.; Wiesendanger, R.; Lukmanov, R.; Moreno-García, P.; Lörtscher, E.; Wurz, P.; Broekmann, P. (2020). Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry. Analytical chemistry, 92(1), pp. 1355-1362. American Chemical Society 10.1021/acs.analchem.9b04530
Cedeño López, A.; Grimaudo, V.; Moreno-García, P.; Riedo, Andreas; Tulej, Marek; Wiesendanger, R.; Wurz, Peter; Broekmann, Peter (2018). Towards femtosecond laser ablation ionization mass spectrometric approaches for chemical depth-profiling analysis of lead-free Sn solder bumps with minimized side-wall contributions. Journal of analytical atomic spectrometry, 33(2), pp. 283-293. Royal Society of Chemistry 10.1039/c7ja00295e
Riedo, Andreas; Grimaudo, V.; Moreno-García, P.; Neuland, Maike Brigitte; Tulej, Marek; Wurz, Peter; Broekmann, Peter (2015). High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures. Journal of analytical atomic spectrometry, 30(12), pp. 2371-2374. Royal Society of Chemistry 10.1039/C5JA00295H