Nguyen, Thi

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Journal Article

Huynh, Thi; Weiss, Florian; Nguyen, Thi; Reckien, Werner; Bredow, Thomas; Fluegel, Alexander; Arnold, Marco; Mayer, Dieter; Keller, Hubert; Broekmann, Peter (2013). On the role of halides and thiols in additive-assisted copper electroplating. Electrochimica acta, 89, pp. 537-548. Elsevier Science 10.1016/j.electacta.2012.10.152

Huynh, Thi; Nguyen, Thi; Broekmann, Peter (2013). Quasi-Reversible Interaction of MPS and Chloride on Cu(100) Studied by In Situ STM. Journal of the electrochemical society, 160(12), D3063-D3069. Electrochemical Society (ECS) 10.1149/2.012312jes

Nguyen, Thi; Janser, Ariane Félice; Lüdi, Nicola; Broekmann, Peter (2013). Tailored Design of Suppressor Additives for Copper Plating by Combining Functionalities. ECS electrochemistry letters, 2(11), D52-D54. Electrochemical Society (ECS) 10.1149/2.005311eel

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