Huynh, Thi; Weiss, Florian; Nguyen, Thi; Reckien, Werner; Bredow, Thomas; Fluegel, Alexander; Arnold, Marco; Mayer, Dieter; Keller, Hubert; Broekmann, Peter (2013). On the role of halides and thiols in additive-assisted copper electroplating. Electrochimica acta, 89, pp. 537-548. Elsevier Science 10.1016/j.electacta.2012.10.152
Full text not available from this repository.Item Type: |
Journal Article (Original Article) |
|---|---|
Division/Institute: |
08 Faculty of Science > Department of Chemistry, Biochemistry and Pharmaceutical Sciences (DCBP) |
UniBE Contributor: |
Huynh, Thi Mien Trung, Weiss, Florian (B), Nguyen, Thi Minh Hai, Broekmann, Peter |
Subjects: |
500 Science > 570 Life sciences; biology 500 Science > 540 Chemistry 500 Science |
ISSN: |
0013-4686 |
Publisher: |
Elsevier Science |
Language: |
English |
Submitter: |
Beatrice Niederhauser |
Date Deposited: |
25 Jul 2014 16:20 |
Last Modified: |
29 Mar 2023 23:33 |
Publisher DOI: |
10.1016/j.electacta.2012.10.152 |
URI: |
https://boris.unibe.ch/id/eprint/48929 |
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