Hai, N.T.M.

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Journal Article

Hai, N.T.M.; Huynh, T.T.M.; Fluegel, A.; Arnold, M.; Mayer, D.; Reckien, W.; Bredow, T.; Broekmann, P. (2012). Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating. Electrochimica acta, 70, pp. 286-295. Kidlington, UK: Elsevier Science 10.1016/j.electacta.2012.03.054

Hai, N.T.M.; Krämer, K.W.; Fluegel, A.; Arnold, M.; Mayer, D; Broekmann, P. (2012). Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating. Electrochimica acta, 83, pp. 367-375. Kidlington, UK: Elsevier Science 10.1016/j.electacta.2012.07.036

Hai, N.T.M.; Oderrnatt, J.; Grimaudo, V.; Krämer, K. W.; Fluegel, A.; Arnold, M.; Mayer, D.; Broekmann, P. (2012). Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor Additives. Journal of physical chemistry. C, 116(12), pp. 6913-6924. Washington, D.C.: American Chemical Society 10.1021/jp2096086

Broekmann, P.; Flügel, A.; Emnet, C.; Arnold, M.; Roeger-Goepfert, C.; Wagner, A.; Hai, N.T.M.; Mayer, D. (2011). Classification of suppressor additives based on synergistic and antagonistic ensemble effects. Electrochimica acta, 56(13), pp. 4724-4734. Kidlington, UK: Elsevier Science 10.1016/j.electacta.2011.03.015

Hai, N.T.M.; Huynh, T.M.T.; Flügel, A.; Mayer, D.; Broekmann, P. (2011). Adsorption behavior of redox-active suppressor additives: Combined electrochemical and STM studies. Electrochimica acta, 56(21), pp. 7361-7370. Kidlington, UK: Elsevier Science 10.1016/j.electacta.2011.06.008

Simona, F.; Hai, N.T.M.; Broekmann, P.; Cascella, M. (2011). From Structure to Function: Characterization of Cu(I) Adducts in Leveler Additives by DFT Calculations. The journal of physical chemistry letters, 2(24), pp. 3081-3084. Washington, D.C.: American Chemical Society 10.1021/jz201430h

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